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Home Technical InformationApplication Notes
 
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  Application Notes  
     
 

The following Application Notes have been written by the Engineers at Syfer Technology. These cover varied topics and new product developments.

Please click on the links below to go to the appropriate Application Note.

aPPLICATION NOTE CONTENTS

AN0001 Flexicap Termination  

Details of the FlexiCap™ termination, which helps prevent mechanical cracking of multilayer chip capacitors

AN0002 Bend Testing

Test methods for Capacitor bend testing, and the shape of typical cracks
AN0004 Quality and Reliability Data Testing methods and FIT rates
AN0005 Mechanical Cracking Potential causes of mechanical cracking, corrective actions and depanelisation methods
AN0006 Dielectric Ageing Capacitor dielectric ageing
AN0007 Stacked Chips Stack Chip components, handling and usage 
AN0008 Restricted Substances and Lead-free Soldering Restricted substances and Lead-free soldering
AN0009 AEC-Q200 Stress Test Qualification  Provides information on tests performed by Syfer in accordance with the AEC-Q200 specification
AN0010 Lead-free soldering and bend test performance The effects of Lead-free soldering on bend testing through solder choice
AN0011 Solder alloy choice and stress release cracking in through hole ceramic capacitors Solder alloy considerations when using through hole ceramic capacitors to minimise stress cracking
AN0012 Electronic Lighting Ballasts The use of ceramic capacitors for use in electronic lighting ballasts
AN0013 Packaging Labels for RoHS compliant parts How Syfer parts are labelled for RoHS compliance and Lead-free solder processing
AN0014 X2Y Balanced Line EMI Chip Reliability and Performance data X2Y Component reliability and performance data
AN0016 Micro-sectioning of Multilayer Ceramic Capacitors A guide to the preparation and examination of micro-sections to facilitate internal structural evaluation
AN0017 Surface Treated Capacitors A new surface treatment that is used to prevent surface arcing on chip capacitors
AN0018 EMI Suppression for DC Motors using X2Y The application of X2Y chips for EMI Suppression in DC motors
AN0019 Tin Whiskers Tin Whiskers mitigation and surface mount chip capacitors
AN0021 Tandem Capacitors Tandem capacitors terminated with FlexiCap™ provide an ultra robust and reliable component.
AN0022 Open Mode Capacitors Open mode capacitors terminated with FlexiCap™ provide a robust component that fail in an open circuit mode.
 AN0024 Moisture Sensitivity Level Classification for Syfer products MSL classification IPC / JEDEC J-STD-020D for Syfer products.
AN0025 LCD Inverter range of SM ceramic capacitors  5KV and 6KV range of SM ceramic capacitors for high voltage LCD inverters.
 AN0026 Outgassing test results for FlexiCap™ capacitors Results for ECSS-Q-70-02A outgassing tests on FlexiCap™ capacitors.
AN0027 European REACH Regulation  REACH regulation information for Syfer products.
AN0028 Soldering / Mounting Chip Capacitors, Radial Leaded Capacitors and EMI Filters This gives guidance to engineers and board designers on mounting and soldering Syfer products.
AN0029 Use of Syfer MLCC's at high Temperatures  This gives information on how Syfer product could be suitable for use at elevated temperatures of up to 200°C.
AN0030 High Voltage MLCC for use on Power Supplies Small form MLCC's for use in high voltage power supplies and converters.
AN0031 Metal Oxide Varistor Planar Array  Using MOV planar array technology for transient protection in filtered connectors.
AN0032 MLCC for use in modems MLCC for use in modems.
AN0033 AC250 Range AC250 Range: Non-Safety AC MLCC for use at Mains Voltages.
 
     
     
     
 
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