FlexiCap™ has been developed as a result of listening to customers’ experiences of stress damage to MLCC’s from many manufacturers, often caused by variations in production processes. Our answer is a proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish. FlexiCap™ will accommodate a greater degree of board bending than conventional capacitors.
Although normally applied to X7R and X8R dielectrics, it is also available as an option for C0G/NP0 ceramic dielectrics.
The FlexiCap™ termination can be applied to many of the Syfer product range, including:
- standard MLCC capacitors - Surge and Safety capacitors - 3 terminal EMI chip capacitors - X2Y chips - planar capacitor arrays - is applied to X8R high temperature chips as standard - also applied to 1206 size SBSP pi-filters as standard
The benefit to the user is to facilitate a wider process window - giving a greater safety margin and substantially reducing the typical root causes of mechanical stress cracking.
Based upon board bend tests in accordance with IEC 60384-1 the amount of board bending required to mechanically crack a polymer terminated capacitor is almost doubled compared with standard terminated capacitors.
FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes. Syfer has delivered millions of FlexiCap™ components and during that time has collected substantial test and reliability data, working in partnership with customers world wide, to eliminate mechanical cracking.
See the PRODUCT INFO panel on the right for more details: